Viton® Seal
ISO 9001 Registered

Problem Solving Products, Inc. Logo
Problem Solving Products, Inc.

7108 S. Alton Way, Unit I
Centennial, Colorado 80112
(303) 758-2728

Basic Information
Home
Contact Information
Quality Policy

Viton O-rings Seals
Viton® o-rings, seals
Viton® news
Viton® news archive

Kalrez O-rings Seals
Kalrez® o-rings, seals
Kalrez® news
Kalrez® news archive

Simriz O-rings Seals
Simriz® o-rings, seals

Elastomers
Elastomers
Elastomer properties
Fluid compatibility

Mechanical Seal Design
Operating principles
Classification
Application limits
Drive mechanisms
Loading devices
Mating ring types
Gland design

O-ring, Seal Design
O-ring, seal design
spacer3 Considerations
spacerFinite element
spacerStatic seals
spacerspacerAxial static 1
spacerspacerAxial static 2
spacerspacerTrapezoidal
spacerspacerConical static
spacerspacerBoss seal
spacerspacerRadial static
spacerDynamic seals
spacerspacerRotary
spacerspacerReciprocating
spacerTo consider 1
spacerspacerTo consider 2
spacerspacerTo consider 3
spacerSemiconductor
spacerVacuum sealing
spacerspacerPermeation
spacerspacerOutgassing
spacerspacerTrapped gas
Seal failure
AS568A sizes

Products
Products

Industries
Industries

Miscellaneous
Problems solved
O-ring, seal tips
Glossary of terms

Resources
Resources

(303) 758-2728

Semiconductor Plasma Environments and Elastomer Seals

Semiconductor plasma environments offer significant challenges for elastomer seals. Specific chemistries for metal, oxide, poly etch and photoresist stripping equipment include the use of fluorine-, oxygen-, and chlorine-partially-ionized plasmas.

The plasmas typically used are called "glow-discharge," and they operate in the range of 10-4 to 10 Torr, with electron densities of 109 to 1012 cm-3, and ion temperatures of 0.03 to 0.04eV (100-200°C).

The function of a plasma is determined by: 1) the ability to deliver a uniform flux of energetic (+) ions to a surface with controllable energy and flux, and 2) the ability to deliver spatially uniform, relatively large fluxes of atoms and/or molecular radicals to surfaces. Three plasma properties that affect performance are:

  • Chemical Reactivity-The partially ionized gas exhibits greater chemical reactivity.
  • Ion Bombardment-Collision of ions and solid surfaces can generate vertical profiles and sputtering of material. Ion energies (100 -1000eV) transferred to the lattice atoms create a very short-lived cascade of moving atoms. If some of these atoms have enough energy to overcome the binding energy with the right path (trajectory) they form sputtered particles (atoms). (One atom/~500eV.) These moving lattice atoms can cause chemical reactions to occur.
  • Electron Bombardment-Less important than the effects of energetic ions and chemically active radicals. Major effects are substrate heating and degradation of radiation-sensitive materials, e.g., plastics.

Elastomer: plasma weight lossTraditional measures of elastomer compatibility cover volume swell and physical property degradation as a result of exposure to the gas. Plasma environments offer many additional challenges for compatibility and contamination performance of the elastomer.

Measures of elastomer compatibility in plasma environments should include weight loss (including elastomer physical properties), and surface structural and chemical changes as measured by SEM/EDS and ESCA. With all the variables involved, testing of the elastomer in the actual application is recommended. CF4 O2 1.00E+0 9.

Plasma weight loss with various elastomers

Next Topic Sealing in a Vacuum

 

PSP Inc. at www.pspglobal.com
© 1997-2008, Problem Solving Products, Inc.
Submit Your Industrial Website
Site Map 1 | Site Map 2 | Site Map 3
Privacy Statement | Terms of Use