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Semiconductor Plasma Environments and Elastomer SealsSemiconductor plasma environments offer significant challenges for elastomer seals. Specific chemistries for metal, oxide, poly etch and photoresist stripping equipment include the use of fluorine-, oxygen-, and chlorine-partially-ionized plasmas. The plasmas typically used are called "glow-discharge," and they operate in the range of 10-4 to 10 Torr, with electron densities of 109 to 1012 cm-3, and ion temperatures of 0.03 to 0.04eV (100-200°C). The function of a plasma is determined by: 1) the ability to deliver a uniform flux of energetic (+) ions to a surface with controllable energy and flux, and 2) the ability to deliver spatially uniform, relatively large fluxes of atoms and/or molecular radicals to surfaces. Three plasma properties that affect performance are:
Measures of elastomer compatibility in plasma environments should include weight loss (including elastomer physical properties), and surface structural and chemical changes as measured by SEM/EDS and ESCA. With all the variables involved, testing of the elastomer in the actual application is recommended. CF4 O2 1.00E+0 9.
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