Glossary - H's
Hardness (r) a material’s ability to resist a distorting force (indentor point).
Heat buildup (r) the accumulation of thermal energy generated within a material as a result of hysteresis, evidenced by an increase in temperature.
Hertz (Hz) an international unit for frequency—the number of cycles per second.
Hole (sc) the absence of a valence electron in a semiconductor crystal. Motion of a hole is equivalent to motion of a positive charge.
Homogeneous having uniform composition or structure.
Homogenization (r) repeated passage of raw rubber through a mill or other mixing device, under specified conditions, to ensure uniformity.
Homopolymer (r) a polymer formed from a single monomer species.
Hybrid integrated circuit (sc) a structure consisting of an assembly of one or more semiconductor devices and a thin-film integrated circuit on a single substrate, usually ceramic.
Hydrogen bonding unusually strong dipole-dipole attractions that occur among molecules in which hydrogen is bonded to a highly electronegative atom.
Hydrophilic affinity toward water (water-loving); a hydrophilic surface is one that will allow water to spread across it in large puddles.
Hydrophobic aversion to water; a hydrophobic surface will not allow large puddles of water, but rather will form droplets. These surfaces are often termed “de-wetted.”
Hydroscopic attracts and absorbs water.
Hysteresis the lagging of strain behind stress during deformation.
Our specialty is solving sealing problems for original equipment manufacturers. We carry o-rings, seals, custom molded rubber parts, wipers, diaphrams, valves and u-cups in all types of materials including Kalrez®, FKM fluorocarbon, Simriz®, nitrile (buna-n), silicone, rubber, neoprene, polyurethane, TFE and FEP encapsulated.